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UPH Compounds Thermal Paste Super Thermal Compound for heat transfering from CPU to heatsink / heatsink fan.
- Thermal Conductivity: >1.22W/m.k
- Thermal Resistance: <0.201 degree-in2/W
UPH Thermal Paste & Plate
From 0.910 (SGD)
UPH Compounds Thermal Paste
- Thermal Conductivity: >1.22W/m.k
- Thermal Resistance: <0.201 degree-in2/W
UPH Thermal Paste & Plate
From 5.500 (SGD)
UPH Compounds Thermal Paste
- Thermal Conductivity: >2.17W/m.k
- Thermal Resistance: <0.06 degree-in2/W
UPH Thermal Paste & Plate
From 0.910 (SGD)
UPH Compounds Thermal Paste
UPH Thermal Paste & Plate
From 2.260 (SGD)
UPH Compounds Thermal Paste
- Thermal Conductivity: >7.5W/m-k
- Thermal Resistance: <0.06'C/W
- 25% Silver Include
UPH Thermal Paste & Plate
From 5.500 (SGD)
UPH Compounds Thermal Paste
- Thermal Conductivity: >1.22W/m.k
- Thermal Resistance: <0.201 degree-in2/W
UPH Thermal Paste & Plate
From 0.730 (SGD)
UPH Compounds Thermal Paste
RoHS compliant- Thermal silica paste, thermal conductivity for computer cpu, electronic equipment.
Color: Milky
State: Paste
UPH Thermal Paste & Plate
From 2.330 (SGD)
Kafuter Thermal Thermal Paste
RoHS compliant- Thermal silica, thermal conductivity of 0.8, for bonding components and heat radiators, heat generated by components derived
- Color : Gray
- State : Paste
- Suface Drying time minutes : ≤ 30
- Fully dried : 24 hours
- Tensile strength Mpa : ≥ 2.5
- Shear strength MPa : ≥ 1.5
Kafuter Thermal Paste & Plate
From 5.190 (SGD)
UPH Compounds Thermal Paste
- This item is sold as a sheet of 25mm width x 1 meter length..
- Use for bonding between the CPU or chip and the heat sink, to maximize the heat transfer.
UPH Thermal Paste & Plate
From 13.280 (SGD)
UPH Compounds Thermal Paste
UPH Thermal Paste & Plate
From 2.260 (SGD)
UPH Compounds Thermal Paste
- Thermal Conductivity: >1.829W/m.k
- Thermal Resistance: <0.123 degree-in2/W
UPH Thermal Paste & Plate
From 0.790 (SGD)
UPH Compounds Thermal Paste
UPH Thermal Paste & Plate
From 10.070 (SGD)
